We offer a comprehensive range of etched and stamped leadframes for ICs, discrete components, and power semiconductors.
We deliver optimal manufacturing solutions tailored to your technical requirements and production volume.
- Etched Leadframes: Perfect for high-density, fine-pitch patterns. Ideal for rapid small-lot prototyping and high-pin-count packages without the need for expensive tooling.
- Stamped Leadframes: Processed via high-speed progressive dies. Engineered to maximize cost-efficiency and quality consistency in high-volume mass production lines.
We flexibly support everything from low-cost prototype development to stable, high-volume mass production supply chains.