We offer a comprehensive range of Epoxy Molding Compounds (EMC) and encapsulation resins for ICs, discrete components, and power semiconductors.
Engineered to meet the stringent demands of next-generation power devices (SiC/GaN) and automotive modules, our molding resins feature outstanding thermal resistance, heat dissipation, and electrical insulation.
- Diverse Formats Available: Wide lineup of options including various sizes/shapes of resin tablets (pellets) perfectly optimized for automated transfer molding equipment, as well as powder forms.
- Optimized for High-Power Applications: Formulated to minimize warpage under high-voltage and high-temperature conditions, ensuring long-term reliability and maximum assembly yield.
We flexibly support everything from low-volume evaluations and prototyping to stable, high-volume mass production supply chains.